Reflow soldering is the most common form of attaching surface mount components to printed circuit boards (PCBs). The solder paste is applied on the PCB that is then subjected to a controlled heating and cooling profile to minimize defects.
Application/Service | Measurement | Gas Stream | Analyzer Options |
Measuring O2 deficiency in confined areas | <19.5-20.0% O2 | Air, N2 | GPR-35 |